SPEAKER MODULE MOUNTING STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME

    公开(公告)号:US20210337055A1

    公开(公告)日:2021-10-28

    申请号:US17368280

    申请日:2021-07-06

    IPC分类号: H04M1/03 H04M1/02 H04R1/02

    摘要: An electronic device is provided. The electronic device includes a housing comprising a front plate facing a first direction, a back plate facing a second direction that is opposite the first direction, and an outer wall which encompasses the space between the front plate and the back plate and in which a pipe passage extending to the outside is arranged, a speaker module positioned in the space, which is adjacent to the pipe passage, a printed circuit board arranged along at least a part of the side surface of the speaker module and formed along the periphery of the region between the outer wall, having the pipe passage, and the speaker module, and a first sealing member arranged between the back plate and a bracket and formed into a closed loop along the edge of the speaker module.