公开(公告)号：US20210249760A1

公开(公告)日：2021-08-12

申请号：US17168321

申请日：2021-02-05

申请人： Samsung Electronics Co., Ltd.

发明人： Younghoon KIM ,  Juhyun PARK ,  Younggirl YUN ,  Taewook HAM ,  Haejin LEE ,  Jooho JANG

IPC分类号： H01Q1/24 ,  H01Q1/02 ,  H04B1/00 ,  H01Q1/52

摘要： According to certain embodiments, an electronic device comprises: a window forming at least a portion of a front surface of the electronic device; a cover forming at least a portion of a rear surface of the electronic device; a bracket disposed between the window and the cover; a printed circuit board supported by the bracket and disposed between the window and the cover; a shield can disposed on the printed circuit board covering a designated area of the printed circuit board; at least one communication processor disposed on the printed circuit board; and a mmWave antenna module connected to the printed circuit board, and electrically connected with the at least one communication processor via the printed circuit board, wherein the mmWave antenna module is disposed on the shield can and configured to transfer heat to the shield can.