公开(公告)号：US10032780B2

公开(公告)日：2018-07-24

申请号：US15139444

申请日：2016-04-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min Hee Cho ,  Satoru Yamada ,  Sung-Sam Lee ,  Jung-Bun Lee

IPC: H01L27/108 ,  H01L23/522

Abstract: A semiconductor device may include a plurality of dummy wirings formed on a substrate at different vertical levels and electrically floated and a plurality of dummy contact plugs each electrically connected between two adjacent dummy wirings of the plurality of dummy wiring of the plurality of dummy wirings. No dummy wiring of the plurality of dummy wirings is electrically connected to a terminal of any one of a plurality of transistors included in the substrate.