公开(公告)号：US10010016B2

公开(公告)日：2018-06-26

申请号：US15415181

申请日：2017-01-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-deok Lim ,  Jung-je Bang ,  Hyun-tae Jang ,  Hye-in Park ,  Jae-heung Ye ,  Chan-beom Jeong ,  Sae-bom Lee ,  Yong-won Lee

IPC: H01R4/64 ,  H05K9/00

CPC classification number: H05K9/0032 ,  H01R4/64

Abstract: A shield can device is provided. The shield can device includes a frame which is fixed to a printed circuit board (PCB) and surrounds at least one circuit device as an electromagnetic shielding target, a cover which is coupled to the frame and closes an opening formed in a top of the frame, and a plurality of contact projections which are formed between the frame and the cover and allow the frame and the cover to be in electrical contact with each other.