公开(公告)号：US20240139972A1

公开(公告)日：2024-05-02

申请号：US18206635

申请日：2023-06-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daeho Min ,  Minwoo Rhee ,  Juno Kim ,  Kazuya ONO ,  Kangsan Lee ,  Kyeongbin Lim

IPC: B25J15/06 ,  B25J11/00

CPC classification number: B25J15/0658 ,  B25J11/0095

Abstract: A non-contact type gripper may include a gripping plate, a plurality of blowing holes, a plurality of suction holes and a cavity. The blowing holes may be formed at the gripping plate to inject a gas to an object. The suction holes may be formed at the gripping plate to suck the gas. The cavity may be extended from at least one of the blowing holes to suppress a pressure drop of the gas. The gas flowing through the cavities extended from the corner suction hole and the blowing holes between the adjacent suction holes may receive a low flow resistance. Thus, a pressure drop of the gas injected from the blowing holes may be suppressed by the cavities to maintain a pressure of the gas, thereby preventing a deflection of the corner portion of the object such as the semiconductor chip by a strong suction force. As a result, the non-contact type gripper may grip the object in the non-contact manner to prevent a contamination of the object.

公开(公告)号：US12136563B2

公开(公告)日：2024-11-05

申请号：US17315604

申请日：2021-05-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mingu Lee ,  Chulhyun Park ,  Kangsan Lee ,  Eunhaeng Lee ,  Euisun Choi

IPC: H01L21/683 ,  H01L21/677 ,  H01L21/68

Abstract: A semiconductor manufacturing apparatus configured to bond a substrate to a semiconductor chip includes a support configured to mount a substrate on a main surface of the support; and a bonding head configured to transfer the semiconductor chip to stack the semiconductor chip on the substrate and including an attachment pad configured to attach the semiconductor chip, wherein the attachment pad includes a bottom surface configured to attach the semiconductor chip; a vacuum channel extending from the bottom surface; and a cavity, and wherein the bonding head is configured to adjust a shape of the bottom surface of the attachment pad by adjusting a pressure of air in the cavity.

公开(公告)号：US20220102185A1

公开(公告)日：2022-03-31

申请号：US17315604

申请日：2021-05-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mingu Lee ,  Chulhyun Park ,  Kangsan Lee ,  Eunhaeng Lee ,  Euisun Choi

IPC: H01L21/683 ,  H01L21/68 ,  H01L21/677

Abstract: A semiconductor manufacturing apparatus configured to bond a substrate to a semiconductor chip includes a support configured to mount a substrate on a main surface of the support; and a bonding head configured to transfer the semiconductor chip to stack the semiconductor chip on the substrate and including an attachment pad configured to attach the semiconductor chip, wherein the attachment pad includes a bottom surface configured to attach the semiconductor chip; a vacuum channel extending from the bottom surface; and a cavity, and wherein the bonding head is configured to adjust a shape of the bottom surface of the attachment pad by adjusting a pressure of air in the cavity.