公开(公告)号：US20250096179A1

公开(公告)日：2025-03-20

申请号：US18754738

申请日：2024-06-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wooyoung KIM ,  Yeonho JANG ,  Kimin CHEONG

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/49 ,  H01L23/498 ,  H01L23/552 ,  H01L25/10

Abstract: A semiconductor package may include a first wiring structure including a plurality of first redistribution patterns and a plurality of first redistribution insulating layers, a second wiring structure on the first wiring structure and including a plurality of second redistribution patterns and a plurality of second redistribution insulating layers, a semiconductor chip between the first wiring structure and the second wiring structure, an expanded layer including a plurality of connection structures electrically connecting the first wiring structure and the second wiring structure to each other and an encapsulant surrounding the plurality of connection structures and the semiconductor chip, a ceramic shield layer between the expanded layer and the second wiring structure, and a plurality of via structures penetrating the ceramic shield layer and electrically connecting the plurality of connection structures and the plurality of second redistribution patterns to each other.