公开(公告)号：US20220165603A1

公开(公告)日：2022-05-26

申请号：US17671022

申请日：2022-02-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kunsil LEE ,  Seung Hwan Lee

IPC: H01L21/683 ,  H01L21/56 ,  H01L23/544 ,  H01L23/31 ,  H01L21/78

Abstract: Disclosed are support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same. The support substrate comprises a main body, and a plurality of first protrusions finely protruding from an upper surface of the main body. The main body and the first protrusions include the same material and are formed as a unitary structure. The first protrusions are spaced apart from each other in first and second directions intersecting each other, when viewed in plan.

公开(公告)号：US20240186294A1

公开(公告)日：2024-06-06

申请号：US18438658

申请日：2024-02-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kunsil LEE ,  Dongkwan KIM

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517

Abstract: A semiconductor package is disclosed. The semiconductor package includes a base structure, a first semiconductor chip over the base structure, a second semiconductor chip over the first semiconductor chip, an adhesive layer between the first semiconductor chip and the second semiconductor chip, and a molding layer covering the first semiconductor chip, the second semiconductor chip and the adhesive layer, and including an interposition portion interposed between the base structure and the first semiconductor chip.

公开(公告)号：US20220223566A1

公开(公告)日：2022-07-14

申请号：US17384046

申请日：2021-07-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kunsil LEE ,  Dongkwan KIM

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package is disclosed. The semiconductor package includes a base structure, a first semiconductor chip over the base structure, a second semiconductor chip over the first semiconductor chip, an adhesive layer between the first semiconductor chip and the second semiconductor chip, and a molding layer covering the first semiconductor chip, the second semiconductor chip and the adhesive layer, and including an interposition portion interposed between the base structure and the first semiconductor chip.

公开(公告)号：US20210020490A1

公开(公告)日：2021-01-21

申请号：US17060800

申请日：2020-10-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kunsil LEE ,  Seung Hwan LEE

IPC: H01L21/683 ,  H01L21/56 ,  H01L23/544 ,  H01L23/31 ,  H01L21/78

Abstract: Disclosed are support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same. The support substrate comprises a main body, and a plurality of first protrusions finely protruding from an upper surface of the main body. The main body and the first protrusions include the same material and are formed as a unitary structure. The first protrusions are spaced apart from each other in first and second directions intersecting each other, when viewed in plan.