公开(公告)号：US20230117654A1

公开(公告)日：2023-04-20

申请号：US17847130

申请日：2022-06-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Namhoon KIM ,  Kwangyoul LEE

IPC: H01L23/16 ,  H01L25/065 ,  H01L25/00

Abstract: A semiconductor package includes a first semiconductor chip; a lower dam structure disposed on an edge of a top surface of the first semiconductor substrate; a second semiconductor chip, which is mounted on the first semiconductor chip; an upper dam structure disposed on an edge of the bottom surface of the second semiconductor substrate; a chip connecting terminal disposed between the first semiconductor chip and the second semiconductor chip and connecting the first semiconductor chip to the second semiconductor chip; and an adhesive layer disposed between the first semiconductor chip and the second semiconductor chip and surrounding the chip connecting terminal.