公开(公告)号：US20210111270A1

公开(公告)日：2021-04-15

申请号：US16798482

申请日：2020-02-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： CHANG WOO SOHN ,  SEUNG HYUN SONG ,  SEON-BAE KIM ,  MIN CHEOL OH ,  YOUNG CHAI JUNG

IPC: H01L29/66

Abstract: Integrated circuit devices and methods of forming the same are provided. The methods may include forming a dummy channel region and an active region of a substrate, forming a bottom source/drain region on the active region, forming a gate electrode on one of opposing side surfaces of the dummy channel region, and forming first and second spacers on the opposing side surfaces of the dummy channel region, respectively. The gate electrode may include a first portion on the one of the opposing side surfaces of the dummy channel region and a second portion between the bottom source/drain region and the first spacer. The methods may also include forming a bottom source/drain contact by replacing the first portion of the gate electrode with a conductive material. The bottom source/drain contact may electrically connect the second portion of the gate electrode to the bottom source/drain region.