公开(公告)号：US20250118677A1

公开(公告)日：2025-04-10

申请号：US18791420

申请日：2024-07-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin YANG ,  WooPoung KIM ,  Ramkumar SUBRAMANIAN ,  Sriram BALASUBRAMANIAN ,  Martin Philip SCOTT

IPC: H01L23/538 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/48 ,  H01L25/065 ,  H01L25/18 ,  H10B80/00

Abstract: A method, system and devices are disclosed providing a first layer, the first layer including a first device region and a second device region, and a second layer including an interconnection die, the interconnection die including an interface logic. The first device region and the second device region are mounted on a first side of the interconnection die, and the first device region and the second device region are communicatively coupled to the interface logic.