公开(公告)号：US20170048364A1

公开(公告)日：2017-02-16

申请号：US15161754

申请日：2016-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min-Young PARK ,  Kwangmin KIL ,  Jae-Joon YOO ,  Chang-Youl LEE ,  Janghoon KANG ,  Taeeon KIM ,  Youngbae PARK

IPC: H04M1/02 ,  H04R1/02

CPC classification number: H04R1/028 ,  H04M1/03 ,  H04R1/023 ,  H04R1/025 ,  H04R2499/11

Abstract: A slim electronic device is provided. The slim electronic device includes a substrate having an opening formed therein, and an audio component accommodated in the opening of the substrate without overlapping the substrate and disposed such that the top and bottom thereof are substantially parallel to the top and bottom of the substrate.

Abstract translation: 提供了一种超薄的电子设备。 细长电子器件包括其中形成有开口的基板和容纳在基板的开口中的音频部件，​​而不与基板重叠，并且被布置成使得其顶部和底部基本上平行于基板的顶部和底部。