公开(公告)号：US20200227452A1

公开(公告)日：2020-07-16

申请号：US16458229

申请日：2019-07-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Masaru Ishii ,  Tae-hyoung Kim ,  Min-ho Jang ,  In-sung Joe

IPC: H01L27/146

Abstract: An image sensor includes a semiconductor substrate having opposite first and second surfaces, a wiring structure on the first surface of the semiconductor substrate, and a refractive structure on the second surface of the semiconductor substrate. The refractive structure includes a first anti-reflective layer on the second surface of the semiconductor substrate, a refractive pattern on the first anti-reflective layer, an insulation layer on the first anti-reflective layer, and a second anti-reflective layer on the refractive pattern and the insulation layer. The refractive pattern includes first refractive parts spaced apart from each other in a first direction parallel to the second surface of the semiconductor substrate, and the insulation layer fills spaces between the first refractive parts.

公开(公告)号：US11264414B2

公开(公告)日：2022-03-01

申请号：US16458229

申请日：2019-07-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Masaru Ishii ,  Tae-hyoung Kim ,  Min-ho Jang ,  In-sung Joe

IPC: H01L27/146

Abstract: An image sensor includes a semiconductor substrate having opposite first and second surfaces, a wiring structure on the first surface of the semiconductor substrate, and a refractive structure on the second surface of the semiconductor substrate. The refractive structure includes a first anti-reflective layer on the second surface of the semiconductor substrate, a refractive pattern on the first anti-reflective layer, an insulation layer on the first anti-reflective layer, and a second anti-reflective layer on the refractive pattern and the insulation layer. The refractive pattern includes first refractive parts spaced apart from each other in a first direction parallel to the second surface of the semiconductor substrate, and the insulation layer fills spaces between the first refractive parts.