公开(公告)号：US20200084881A1

公开(公告)日：2020-03-12

申请号：US16422969

申请日：2019-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： SIHYUNG LEE ,  CHANGWOO KO ,  SEON-SIK KIM ,  JIYOON MOON ,  JINOH AHN

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

Abstract: A semiconductor memory module may include a printed circuit board and semiconductor memory packages provided on the printed circuit board. The printed circuit board may include a connector provided at a side region of the printed circuit board and configured to be connected to an external device, signal lines configured to connect the connector to the semiconductor memory packages, a first element configured to provide a first capacitive coupling between first signal lines, which are closest to each other, among the signal lines, a second element configured to provide a second capacitive coupling between second signal lines, which are disposed adjacent to each other with one signal line interposed therebetween, among the signal lines, and a third element configured to provide a third capacitive coupling between third signal lines, which are disposed adjacent to each other with two signal lines interposed therebetween, among the signal lines.