公开(公告)号：US20210320043A1

公开(公告)日：2021-10-14

申请号：US17355831

申请日：2021-06-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-young OH ,  Hyun-ki KIM ,  Sang-soo KIM ,  Seung-hwan KIM ,  Yong-kwan LEE

IPC: H01L23/29 ,  H01L21/56 ,  H01L23/31 ,  H01L23/528 ,  H01L23/00

Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.

公开(公告)号：US20200043820A1

公开(公告)日：2020-02-06

申请号：US16357732

申请日：2019-03-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-young OH ,  Hyun-ki KIM ,  Sang-soo KIM ,  Seung-hwan KIM ,  Yong-kwan LEE

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/528

Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.