PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

    公开(公告)号:US20220285290A1

    公开(公告)日:2022-09-08

    申请号:US17750903

    申请日:2022-05-23

    Abstract: Provided a package substrate including an insulation substrate, a conductive layer provided in the insulation substrate, upper pads provided on an upper surface of the insulation substrate and electrically connected to the conductive layer, lower pads provided on a lower surface of the insulation substrate and electrically connected to the conductive layer, and at least one trench provided at a portion of the insulation substrate adjacent to at least one of the upper pads and configured to block stress, which is generated by an expansion of the insulation substrate, from spreading to the at least one of the upper pads.

    ELECTRONIC DEVICE AND METHOD OF RECEIVING USER INPUT THEREOF

    公开(公告)号:US20170285842A1

    公开(公告)日:2017-10-05

    申请号:US15432019

    申请日:2017-02-14

    Abstract: A method of receiving various user inputs and performing corresponding operations and an electronic device adapted to the method are provided. The electronic device includes an accessory, a display including at least one sensor, and at least one processor. The at least one processor measures at least one of a voltage, a current, and a capacitance, created in response to a touch input applied to the accessory, using the at least one sensor. The processor operates in a first input mode if at least one of the measured quantities satisfies a first condition, and in a second input mode if at least one of the measured quantities satisfies a second condition. The electronic device according to various embodiments is capable of controlling an application, based on the levels of pressure applied to the accessory.

    PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

    公开(公告)号:US20210050308A1

    公开(公告)日:2021-02-18

    申请号:US16810091

    申请日:2020-03-05

    Abstract: Provided a package substrate including an insulation substrate, a conductive layer provided in the insulation substrate, upper pads provided on an upper surface of the insulation substrate and electrically connected to the conductive layer, lower pads provided on a lower surface of the insulation substrate and electrically connected to the conductive layer, and at least one trench provided at a portion of the insulation substrate adjacent to at least one of the upper pads and configured to block stress, which is generated by an expansion of the insulation substrate, from spreading to the at least one of the upper pads.

    METHOD FOR COMPENSATING FOR PRESSURE VALUE OF FORCE SENSOR AND ELECTRONIC DEVICE USING SAME

    公开(公告)号:US20200264751A1

    公开(公告)日:2020-08-20

    申请号:US16762750

    申请日:2018-12-27

    Abstract: Various embodiments of the present invention relate to a method for compensating for a pressure value of a force sensor and an electronic device using the same, the electronic device comprising: a touch screen display; a force sensor bonded to a lower portion of the touch screen display; a memory; and a processor electrically connected to the touch screen display, the force sensor, and the memory, wherein the processor is configured to: obtain a pressure value of the touch screen display and a pressure value of the force sensor; measure the correlation between the obtained pressure value of the touch screen display and the pressure value of the force sensor; identify a spacing state between the touch screen display and the force sensor by using the correlation; determine whether the spacing state is of a predetermined distance or less and compensate for the pressure value for determining whether to operate the force sensor by using a predetermined reference value when the spacing state is of the predetermined distance or less, thereby sensing the spacing state in real time when spacing occurs between the touch screen display and the force sensor of the electronic device, and compensating for the pressure value of the force sensor such that user convenience can be improved. In addition to the embodiments disclosed in the present invention, other various embodiments are possible.

Patent Agency Ranking