公开(公告)号：US10935270B2

公开(公告)日：2021-03-02

申请号：US16069422

申请日：2017-01-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungjae Kim ,  Kwanwoo Song ,  Seong Hwan Oh ,  Daeeun Yi ,  Jeongil Seo ,  Hunjung Lim ,  Hyejung Cho ,  Sunggeun Song

IPC: F24F11/46 ,  F24F11/64 ,  F24F11/56 ,  G06Q50/10 ,  F25B13/00 ,  F25B49/00 ,  F24F11/65 ,  F25B30/02 ,  G05B19/042 ,  F24F110/10 ,  F24F120/12 ,  F24F140/60 ,  F24F140/50

Abstract: An air-conditioning control method for an electronic device is provided that includes determining a rate of temperature change on the basis of changes in the temperature measured for the first time; acquiring first density information on the basis of the determined rate of temperature change and information on a location at which the temperature change is measured; and controlling air-conditioning according to the first density information.

公开(公告)号：US10748871B2

公开(公告)日：2020-08-18

申请号：US16164524

申请日：2018-10-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seong Hwan Oh ,  Kyung Suk Oh ,  Kilsoo Kim

IPC: H01L25/065 ,  H01L21/78 ,  H01L23/00 ,  H01L25/00

Abstract: A semiconductor package may include a package substrate, a first semiconductor chip on the package substrate, and a second semiconductor chip on the first semiconductor chip. The first semiconductor chip comprises a chip substrate including a first surface and a second surface opposite to the first surface, a plurality of first chip pads between the package substrate and the chip substrate, and electrically connecting the first semiconductor chip to the package substrate, a plurality of second chip pads disposed on the second surface and between the second semiconductor chip and the second surface, and a plurality of redistribution lines on the second surface, the redistribution lines electrically connecting to the second semiconductor chip, and a plurality of bonding wires electrically connecting the redistribution lines to the package substrate.