公开(公告)号：US20220093405A1

公开(公告)日：2022-03-24

申请号：US17544990

申请日：2021-12-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin SHIN ,  Woo-Mok SON ,  Nam-Hoon LEE ,  Dong-Eog KIM ,  Seung-Hun OH ,  Eun-Seok LEE ,  Young-Seok JANG

IPC: H01L21/304 ,  H01L21/02 ,  H01L21/66

Abstract: In a method of manufacture, a displacement sensor is provided over a conditioner disk. The conditioner disk is rotated to perform a conditioning process on a polishing surface of a polishing pad. A displacement of the rotating conditioner disk is detected using the displacement sensor during the conditioning process. A height of the conditioner disk is calculated from the detected displacement. An end point of the conditioning process is determined on the polishing surface based on the calculated height.

公开(公告)号：US20200152469A1

公开(公告)日：2020-05-14

申请号：US16426117

申请日：2019-05-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin SHIN ,  Woo-Mok SON ,  Nam-Hoon LEE ,  Dong-Eog KIM ,  Seung-Hun OH ,  Eun-Seok LEE ,  Young-Seok JANG

IPC: H01L21/304 ,  H01L21/02 ,  H01L21/66

Abstract: In a method of manufacture, a displacement sensor is provided over a conditioner disk. The conditioner disk is rotated to perform a conditioning process on a polishing surface of a polishing pad. A displacement of the rotating conditioner disk is detected using the displacement sensor during the conditioning process. A height of the conditioner disk is calculated from the detected displacement. An end point of the conditioning process is determined on the polishing surface based on the calculated height.