公开(公告)号：US09541716B2

公开(公告)日：2017-01-10

申请号：US14206258

申请日：2014-03-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ho-Chul Ji ,  Seung-Hyuk Chang

IPC: G02B6/42

CPC classification number: G02B6/4206 ,  G02B6/4203 ,  G02B6/4214

Abstract: Integrated circuit device packages including optical elements are provided. The integrated circuit device package may include an integrated circuit device and a conductive pad on a first surface of the integrated circuit device. The conductive pad may be electrically connected to the integrated circuit device and may be configured to transmit an electrical signal. The integrated circuit device package may also include an optical element in the integrated circuit device and the optical element may be configured to transmit an optical signal through a second surface of the integrated circuit device that is opposite the first surface of the integrated circuit device.

Abstract translation: 提供了包括光学元件的集成电路器件封装。 集成电路器件封装可以包括在集成电路器件的第一表面上的集成电路器件和导电焊盘。 导电焊盘可以电连接到集成电路器件，并且可以被配置为传输电信号。 集成电路器件封装还可以包括集成电路器件中的光学元件，并且光学元件可以被配置为通过与集成电路器件的第一表面相对的集成电路器件的第二表面传输光信号。

公开(公告)号：US20140270632A1

公开(公告)日：2014-09-18

申请号：US14206258

申请日：2014-03-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ho-Chul JI ,  Seung-Hyuk Chang

IPC: G02B6/12

CPC classification number: G02B6/4206 ,  G02B6/4203 ,  G02B6/4214

Abstract: Integrated circuit device packages including optical elements are provided. The integrated circuit device package may include an integrated circuit device and a conductive pad on a first surface of the integrated circuit device. The conductive pad may be electrically connected to the integrated circuit device and may be configured to transmit an electrical signal. The integrated circuit device package may also include an optical element in the integrated circuit device and the optical element may be configured to transmit an optical signal through a second surface of the integrated circuit device that is opposite the first surface of the integrated circuit device.

Abstract translation: 提供了包括光学元件的集成电路器件封装。 集成电路器件封装可以包括在集成电路器件的第一表面上的集成电路器件和导电焊盘。 导电焊盘可以电连接到集成电路器件，并且可以被配置为传输电信号。 集成电路器件封装还可以包括集成电路器件中的光学元件，并且光学元件可以被配置为通过与集成电路器件的第一表面相对的集成电路器件的第二表面传输光信号。