公开(公告)号：US20190267413A1

公开(公告)日：2019-08-29

申请号：US16407304

申请日：2019-05-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-seok KIM ,  Byung-jun PARK ,  Hee-geun JEONG ,  Seung-joo NAH

IPC: H01L27/146

Abstract: A substrate includes a plurality of pixels arranged in a two-dimensional array structure and has a front side and a back side opposite to the front side. An interconnection is arranged on the front side of the substrate. An insulating layer, a color filter, and a micro-lens are arranged on the back side of the substrate. A pixel separation structure is disposed in the substrate. The pixel separation structure includes a conductive layer having a grid structure in a planar view of the image sensor and surrounds each of the plurality of pixels. A back side contact is vertically overlapped with and electrically connected to a grid point portion of the grid structure of the conductive layer of the pixel separation structure.

公开(公告)号：US20200251509A1

公开(公告)日：2020-08-06

申请号：US16856571

申请日：2020-04-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-seok KIM ,  Byung-jun PARK ,  Hee-geun JEONG ,  Seung-joo NAH

IPC: H01L27/146

Abstract: A substrate includes a plurality of pixels arranged in a two-dimensional array structure and has a front side and a back side opposite to the front side. An interconnection is arranged on the front side of the substrate. An insulating layer, a color filter, and a micro-lens are arranged on the back side of the substrate. A pixel separation structure is disposed in the substrate. The pixel separation structure includes a conductive layer having a grid structure in a planar view of the image sensor and surrounds each of the plurality of pixels. A back side contact is vertically overlapped with and electrically connected to a grid point portion of the grid structure of the conductive layer of the pixel separation structure.

公开(公告)号：US20180286896A1

公开(公告)日：2018-10-04

申请号：US15862396

申请日：2018-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-seok KIM ,  Byung-jun PARK ,  Hee-geun JEONG ,  Seung-joo NAH

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/14627 ,  H01L27/14643 ,  H01L27/14667 ,  H01L27/14689 ,  H01L27/14694

Abstract: A substrate includes a plurality of pixels arranged in a two-dimensional array structure and has a front side and a back side opposite to the front side. An interconnection is arranged on the front side of the substrate. An insulating layer, a color filter, and a micro-lens are arranged on the back side of the substrate. A pixel separation structure is disposed in the substrate. The pixel separation structure includes a conductive layer having a grid structure in a planar view of the image sensor and surrounds each of the plurality of pixels. A back side contact is vertically overlapped with and electrically connected to a grid point portion of the grid structure of the conductive layer of the pixel separation structure.