公开(公告)号：US20210389966A1

公开(公告)日：2021-12-16

申请号：US17179814

申请日：2021-02-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Lei WANG ,  Gang LI ,  Yuehua DAI ,  Mindong ZHAO ,  Shuang ZHAO

IPC: G06F9/455

Abstract: At least one example embodiment of the inventive concepts include an embedded system including processing circuitry configured to execute an extensible hypervisor, the extensible hypervisor including a micro kernel and a virtualization service layer, the micro kernel is configured to provide a virtualization environment for at least one first-type virtual machine, the virtualization service layer is configured to provide a service interface for at least one second-type virtual machine, and the micro kernel is executed at a first privilege layer, and the virtualization service layer is executed at a second privilege layer.