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    Package
    1.
    外观设计
    Package 有权

    公开(公告)号：USD1002366S1

    公开(公告)日：2023-10-24

    申请号：US29736833

    申请日：2020-06-03

    Applicant: Samsung Electronics Co., Ltd.

    Designer： Dae-Hee Yoon ,  Soo-Hyun Whang ,  Sung-Do Son

    Abstract: FIG. 1 is a front perspective view of a package showing our new design according to a first embodiment;
    FIG. 2 is a front view thereof;
    FIG. 3 is a rear view thereof;
    FIG. 4 is a left-side view thereof;
    FIG. 5 is a right-side view thereof;
    FIG. 6 is a top view thereof;
    FIG. 7 is a bottom view thereof;
    FIG. 8 is a bottom rear perspective view thereof;
    FIG. 9 is an enlarged view of the encircled portion in FIG. 2;
    FIG. 10 is an enlarged view of the encircled portion in FIG. 2;
    FIG. 11 is an enlarged view of the encircled portion in FIG. 2;
    FIG. 12 is an enlarged view of the encircled portion in FIG. 4;
    FIG. 13 is a front perspective view of a package showing our new design according to a second embodiment;
    FIG. 14 is a front view thereof;
    FIG. 15 is a rear view thereof;
    FIG. 16 is a left-side view thereof;
    FIG. 17 is a right-side view thereof;
    FIG. 18 is a top view thereof;
    FIG. 19 is a bottom view thereof;
    FIG. 20 is a bottom rear perspective view thereof; and,
    FIG. 21 is an enlarged view of the encircled portion in FIG. 14.
    The evenly-dashed broken lines in the figures depict portions of the package which form no part of the claimed design.
    The evenly-dashed broken lines which surround claimed surface pattern ornamentation in FIGS. 13-17 and 20, and claimed surfaces in the figures illustrate surface ornamentation that forms no part of the claimed design.
    The dot-dash broken lines encircling portions of the claimed design that are illustrated in enlargements form no part of the claimed design.

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