公开(公告)号：US12261107B2

公开(公告)日：2025-03-25

申请号：US17693867

申请日：2022-03-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Moongil Jung ,  Suhyeon Ku ,  Soyoen Park ,  Kyungsub Kim

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package includes a semiconductor chip; and a redistribution substrate connected to the semiconductor chip, the redistribution structure including a conductive structure including a lower conductive pattern and a redistribution structure on the lower conductive pattern and electrically connected to the lower conductive pattern, an insulating structure covering at least a side surface of the lower conductive pattern or a side surface of the redistribution structure, and a protective layer between the insulating structure and at least one of the lower conductive pattern or the redistribution structure. The protective layer including a first protective layer in contact with at least one of a side surface of the lower conductive pattern or a side surface of the redistribution structure, and a second protective layer in contact with at least a portion of a side surface of the first protective layer.