公开(公告)号：US20230076184A1

公开(公告)日：2023-03-09

申请号：US17875949

申请日：2022-07-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Bo SHIM ,  Sung Bum KIM ,  Ji Hwang KIM

IPC: H01L23/498 ,  H01L25/10 ,  H01L23/31

Abstract: A semiconductor package is provided. A semiconductor package includes a wiring structure, which includes a first insulating layer and a first wiring pad inside the first insulating layer a semiconductor chip on the wiring structure, an interposer having one surface facing the semiconductor chip and including a second insulating layer and a second wiring pad inside the second insulating layer, a connecting member connecting the first wiring pad and the second wiring pad, a support member in the first recess and between the wiring structure and the interposer, and a mold layer covering the semiconductor chip. One surface of the wiring structure includes a first recess exposing at least a part of the first insulating layer.