公开(公告)号：US10608314B2

公开(公告)日：2020-03-31

申请号：US15454537

申请日：2017-03-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Won Park ,  Sun Young Kim ,  Seung Yup Lee

IPC: H01Q1/12 ,  H05K7/14 ,  H01Q1/50

Abstract: An electronic device is provided. The electronic device includes a circuit board, a first conductive member electrically connected to the circuit board at a first point, a second conductive member electrically connected to the circuit board at a second point, and a connection member connecting the first conductive member and the second conductive member, where the connection member includes a first conductive layer electrically connected to the first conductive member, a second conductive layer electrically connected to the second conductive member, and a dielectric layer disposed between the first conductive layer and the second conductive layer.