公开(公告)号：US20190304835A1

公开(公告)日：2019-10-03

申请号：US16442936

申请日：2019-06-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chang-Woo Sun ,  Ji-Eun YUN ,  Jae-Soon LIM ,  Youn-Joung CHO ,  Myong-Woon KIM ,  Kang-yong LEE ,  Sang-Ick LEE ,  Sung-Woo CHO

IPC: H01L21/768 ,  C23C16/455 ,  H01L21/285 ,  C07F17/00 ,  C07F11/00 ,  C23C16/34 ,  C23C16/18

Abstract: An organometallic precursor includes tungsten as a central metal and a cyclopentadienyl ligand bonded to the central metal. A first structure including an alkylsilyl group or a second structure including an allyl ligand is bonded to the cyclopentadienyl ligand or bonded to the central metal.