公开(公告)号：US20150087210A1

公开(公告)日：2015-03-26

申请号：US14462736

申请日：2014-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-choul LEE ,  Choul-gue PARK ,  Ki-hong JUNG ,  Soo-young KIM

IPC: B24B21/00 ,  B24B9/06

CPC classification number: B24B21/002 ,  B24B9/065 ,  B24B37/02

Abstract: A polishing apparatus including a chuck for supporting a wafer while exposing a peripheral portion of the wafer, a polishing head for polishing the peripheral portion of the wafer, and a polishing solution supplying assembly provided above the chuck and configured to spray a polishing solution on the wafer and to form a liquid curtain on the chuck to protect the wafer when the wafer is polished may be provided.

Abstract translation: 一种抛光装置，包括用于在暴露晶片的周边部分的同时支撑晶片的卡盘，用于抛光晶片的周边部分的抛光头和设置在卡盘上方的抛光液供给组件， 并且可以提供在晶片被抛光时在卡盘上形成液体帘以保护晶片。