公开(公告)号：US20200212547A1

公开(公告)日：2020-07-02

申请号：US16694299

申请日：2019-11-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeyoung HUH ,  Seunggil JEON ,  Sunghoon MOON ,  Kyungwoo LEE ,  Sungchul PARK

IPC: H01Q1/27 ,  H04M1/725 ,  H04B17/318 ,  H04B1/3827 ,  H01Q1/52 ,  H01Q3/24 ,  H01Q1/24

Abstract: An electronic device is provided. The electronic device includes a housing configured to mount at least a part of an external device operating 5th generation (5G) mobile communication, a support member connected to one region of the housing to support wearing of the electronic device with respect to one region of a user's body, a second antenna module disposed in a first region of the housing adjacent to a first antenna module among at least one antenna module included in the external device to face at least a part of the first antenna module, at least one third antenna module disposed in at least one of a second region of the housing or a third region of the support member, and at least one conductive member electrically connecting between the second antenna module and the at least one third antenna module.

公开(公告)号：US20200322467A1

公开(公告)日：2020-10-08

申请号：US16839534

申请日：2020-04-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeyoung HUH ,  Kyungwan PARK ,  Seunghoon KANG ,  Boram KIM ,  Youngjin KIM ,  Sunghoon MOON ,  Hongki MOON ,  Yoonsun PARK ,  Hajoong YUN ,  Jonghoon LIM

IPC: H04M1/02 ,  H04N5/225 ,  H05K1/18 ,  H05K7/20

Abstract: An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing