公开(公告)号：US20220192023A1

公开(公告)日：2022-06-16

申请号：US17653601

申请日：2022-03-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongwon PARK ,  Jaegeun SON ,  Jaechan LEE ,  Sunil JIN

IPC: H05K1/14 ,  H05K1/11 ,  H01R12/70 ,  H01R31/06 ,  H01R12/52 ,  H01R12/57

Abstract: A wireless communication board comprises: a communication board; a wireless communication part disposed on the communication board; a power supply provided on the communication board and configured to supply a power source to the wireless communication part; a surface mounting pad that is connected to the wireless communication part and power supply and disposed on a main board by means of the surface mounting technology; and a wire connection connected to the wireless communication part and power supply and connected to the main board by means of a wire, wherein the main board comprises a main processor for controlling the operation of an electronic device.