公开(公告)号：US20210057262A1

公开(公告)日：2021-02-25

申请号：US16834132

申请日：2020-03-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Racine Elysia Auxter NASSAU ,  Namil KOO ,  Suhwan PARK ,  Taeheung AHN ,  Sangyeon OH

IPC: H01L21/683 ,  H01L21/687 ,  G01N21/95

Abstract: A wafer inspection apparatus includes a support structure including a frame and vacuum chucks mounted thereon, each vacuum chuck having a support surface including a vacuum suction portion, the support structure configured to structurally support a wafer on one or more vacuum chucks, the frame defining an opening larger than an area of the wafer. The wafer inspection apparatus includes an electromagnetic wave emitter configured to irradiate an inspection electromagnetic wave to the wafer, a sensor configured to receive the inspection electromagnetic wave from the wafer based on the inspection electromagnetic wave passing through the wafer, and a driver configured to move at least one of the electromagnetic wave emitter or the frame to change an irradiation location of the wafer. Each vacuum chuck is configured to be selectively movable between a first location and a second location in relation to the frame.