公开(公告)号：US20230098815A1

公开(公告)日：2023-03-30

申请号：US17816759

申请日：2022-08-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minki CHO ,  Jungsoo KIM ,  Dohyun AHN ,  Wonchul CHO ,  Taeyun KIM ,  Wonjun JEONG ,  Kwangsic CHOI ,  Chonguk HEO

IPC: H04N5/225 ,  G03B17/55

Abstract: A camera module includes: a printed circuit board having a conductive pad exposed on one surface of the printed circuit board, an image sensor disposed on the printed circuit board, a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to the conductive pad, an actuator disposed above the image sensor and configured to adjust a position of a lens assembly, and a shield can surrounding the actuator and electrically connected to the conductive plate. The conductive plate is configured to emit heat generated from the image sensor to the outside of the camera module by contact with the image sensor.

公开(公告)号：US20220124232A1

公开(公告)日：2022-04-21

申请号：US17500326

申请日：2021-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeongeun LEE ,  Yongwook JANG ,  Wonchul CHO

IPC: H04N5/225 ,  G02B7/02

Abstract: A camera module according to an embodiment of the disclosure may include: a Printed Circuit Board (PCB), a first image sensor and a second image sensor disposed on the PCB, a lens holder having an upper plate facing and spaced apart from the PCB and a sidewall extending from an edge of the upper plate toward the PCB, wherein the upper plate includes a first through-hole and a second through-hole aligned to the first image sensor and the second image sensor, respectively, a first lens assembly including a first lens system and a first barrel accommodating the first lens system, and assembled to the first through-hole to be aligned with the first image sensor, and a second lens assembly including a second lens system and a second barrel accommodating the second lens system, and assembled to the second through-hole to be aligned with the second image sensor. The first barrel may include a first sidewall coupled to the first through-hole and a second sidewall having a greater diameter than the first sidewall and located between the first through-hole and the first image sensor. The second barrel may include a third sidewall coupled to the second through-hole and a fourth sidewall having a greater diameter than the third sidewall and located between the second through-hole and the second image sensor.