公开(公告)号：US20220231403A1

公开(公告)日：2022-07-21

申请号：US17570029

申请日：2022-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woongsun HONG ,  Hongil KWON

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q13/10 ,  H01Q9/04

Abstract: An electronic device is provided and includes a housing, a first substrate disposed in an inner space of the housing, a second substrate disposed on a first surface of the first substrate, a third substrate disposed on a first surface of the second substrate, a first conductive patch attached to at least a partial region of the side surfaces of the first substrate, the second substrate, and the third substrate, and a second conductive patch attached to at least another partial region of the side surfaces of the first substrate, the second substrate, and the third substrate. The first conductive patch and the second conductive patch may be connected to each other via a first electrical path and a second electrical path, a feeding point on the first electrical path may be electrically connected to a communication circuit disposed on the first surface of the first substrate via a third electrical path and, the second electrical path may be electrically connected to a ground disposed on a second surface of the first substrate.