公开(公告)号：US20230068587A1

公开(公告)日：2023-03-02

申请号：US17853205

申请日：2022-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yae Jung YOON ,  Eung Kyu KIM ,  Min Jun BAE ,  Kyoung Lim SUK ,  Seok Hyun LEE ,  Jae Gwon JANG

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/18 ,  H01L23/053

Abstract: A semiconductor package including a passivation film, a mold layer on the passivation film, a connecting pad having a T shape, the T shape including a first portion and a second portion on the first portion, the first portion penetrating the passivation film, the second portion penetrating a part of the mold layer, a solder ball on the first portion of the connecting pad, an element on the second portion of the connecting pad, a wiring structure on the mold layer, the wiring structure including an insulating layer and a wiring pattern inside the insulating layer, and a semiconductor chip on the wiring structure may be provided.