公开(公告)号：US20030197263A1

公开(公告)日：2003-10-23

申请号：US10293532

申请日：2002-11-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yi-Sung Hwang ,  Sang-Woo Kim

IPC: H01L023/48

CPC classification number: H01L23/50 ,  H01L2924/0002 ,  H05K1/181 ,  H01L2924/00

Abstract: A semiconductor chip package with direction-flexible mountability comprising a switching circuit for switching a pin function according to the mounting direction of a package, a pair of pin-definition pins for defining the pin function and a pair of power supply leads, and a pair of ground leads. One of the power supply lead pair and the ground lead pair is rotation-symmetrical to the other, respectively. The semiconductor chip package with direction-flexible mountability in accordance with the present invention eliminates a process for indicating the mounting direction because the package can be mounted onto a substrate regardless the direction. Accordingly, the ID pin indication and a series of processes for testing the ID pin are eliminated and the malfunction due to the incorrect direction is prevented.

Abstract translation: 一种具有方向灵活安装性的半导体芯片封装，包括根据封装的安装方向切换引脚功能的开关电路，用于限定引脚功能的一对引脚定义引脚和一对电源引线，以及一对 的地线。 电源引线对和接地引线对之一分别与另一个旋转对称。 根据本发明的具有方向柔性安装性的半导体芯片封装消除了用于指示安装方向的过程，因为封装可以安装在基板上而与方向无关。 因此，消除了ID引脚指示和用于测试ID引脚的一系列处理，并且防止了由于错误的方向引起的故障。