公开(公告)号：US20180359845A1

公开(公告)日：2018-12-13

申请号：US16007268

申请日：2018-06-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chan-Gi PARK ,  Yikyu MIN ,  Han Min CHO ,  Yeonsang YUN ,  Tae-Wook HAM

IPC: H05K1/02 ,  H05K5/00 ,  H01P3/08 ,  H01Q1/22

CPC classification number: H05K1/024 ,  H01P3/08 ,  H01Q1/22 ,  H05K5/0017 ,  H05K2201/10098

Abstract: A circuit board is provided in which a transmission loss is reduced. The circuit board includes a first layer; a transmission line disposed on the first layer; and a second layer stacked with the first layer. The second layer includes a first region, which is constructed of a first material, corresponding to a position of the transmission line, and a second region, which is constructed of a second material having a permittivity that is different from that of the first material, corresponding to the position of the transmission line.