公开(公告)号：US10757239B2

公开(公告)日：2020-08-25

申请号：US16108280

申请日：2018-08-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Il Seo ,  Ki Jae Kim ,  Dae Young Noh ,  Soon Woong Yang ,  Yong Lak Cho

IPC: H04M1/60 ,  H01R13/74 ,  H04M1/02 ,  G06F1/16 ,  H05K1/02 ,  G06F3/041 ,  H04R1/08

Abstract: An electronic device includes an earphone jack assembly disposed to align with an opening in the housing of the electronic device. The earphone jack assembly includes at least one structure including a first passage having a first cross-sectional area, a second passage having a second cross-sectional area smaller than the first cross-sectional area, a third passage, and a microphone disposed outside of the at least one structure and including a substrate having a hole connected to the third passage. The first passage extends from the opening in a first direction, and includes a first end connected to the opening and a second end opposite to the first end, the second passage extends from the second end of the first passage in the first direction, and the third passage extends from the second passage in a second direction different from the first direction.