公开(公告)号：US20230004199A1

公开(公告)日：2023-01-05

申请号：US17858221

申请日：2022-07-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghyup LEE ,  Beomju KIM ,  Myunggwan PARK ,  Jungsik PARK ,  Yeohwan YOON ,  Hyunwoo LEE ,  Yongchan CHOI ,  Hyunju HONG

IPC: G06F1/16 ,  H01Q1/24 ,  H01Q1/38 ,  H05K1/18

Abstract: An electronic device includes a housing, a first substrate disposed in an internal space of the housing, a conductive structure disposed at a location isolated from the first substrate, a second substrate electrically connected to the conductive structure and the first substrate, and an electrical connection member electrically connecting the second substrate to the conductive structure. The electrical connection member may include a first fixing portion fixed to the conductive structure, a second fixing portion fixed to the second substrate, and a connection portion connecting the first fixing portion and the second fixing portion. The first fixing portion includes a first bent portion bent along a first bent line from a neck portion, that is, a boundary area with the connection portion, and a second bent portion bent along a second bent line from the first bent portion. The first bent portion is bent in a first direction becoming distant from the conductive structure, and the second bent portion is bent in a second direction opposite to the first direction.