公开(公告)号：US20180361630A1

公开(公告)日：2018-12-20

申请号：US15959570

申请日：2018-04-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min KIM ,  Yongha KIM ,  Hyun-Hee LEE ,  Minhyouk KIM ,  Seon-Jung KIM ,  Yuguen KIM ,  Hakju KIM ,  Seon KIM ,  Kyungtae BYUN

IPC: B29C43/02 ,  B29C43/52 ,  B29C35/08

Abstract: According to various embodiments, there may be provided a housing manufacturing method including preparing a base material, disposing at least one patterned structure layer including a plurality of fillers on an upper portion of the base material, and disposing a protective layer on an upper portion of the patterned structure layer. In addition, the housing manufactured by the aforementioned manufacturing method may be applied to at least part of an exterior of an electronic device.

公开(公告)号：US20210286106A1

公开(公告)日：2021-09-16

申请号：US17261898

申请日：2019-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongyi KIM ,  Min KIM ,  Yongha KIM ,  Yongjoon CHOI

IPC: G02B1/115 ,  G02B1/14

Abstract: Disclosed is an electronic device. The electronic device according to various embodiments comprises: a housing; a first glass plate attached to the housing and forming a portion of an external surface of the electronic device, wherein the first glass plate includes a flat portion, a curved portion extending from an edge of the flat portion, a first surface facing outwardly from the electronic device, and a second surface facing inwardly towards the electronic device; and a coating layer formed on the first surface of the first glass plate, wherein the coating layer includes a first layer having a first refractive index and containing at least one first material, and includes a second layer disposed further from the first surface than the first layer, containing at least one second material, and having a second refractive index different from the first refractive index. More specifically, a combination of the first glass plate and the coating layer has a transmittance of 91% to 99%, and with respect to a light having a wavelength of 700 nm to 900 nm, the difference between a minimum reflectance and a maximum reflectance may be 3% or less.

公开(公告)号：US20190025880A1

公开(公告)日：2019-01-24

申请号：US16037313

申请日：2018-07-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngmin SEO ,  Youngsoo LEE ,  Min KIM ,  Yongha KIM

IPC: G06F1/16 ,  G06F3/041

Abstract: In an embodiment, a liquid planarization material is coated on at least one of a first surface and a second surface of the cover glass. The second surface faces a direction opposite the first surface. The liquid planarization material is pressed toward the cover glass by a pressing plate and cured. Then, the pressing plate is detached from the cured planarization material and the cover glass. Other embodiments are possible.

公开(公告)号：US20230048277A1

公开(公告)日：2023-02-16

申请号：US17659778

申请日：2022-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bonggyu KANG ,  Yongha KIM ,  Youngsoo JANG ,  Heesu KIM ,  Kwangsoo PARK ,  Junsik PARK

IPC: H01L23/60 ,  H01L23/367

Abstract: A semiconductor package includes a package board, at least one semiconductor chip disposed on the package board, a molding member disposed on the package board and at least partially surrounding the at least one semiconductor chip, and a heat dissipation member disposed on the at least one semiconductor chip and the molding member. The molding member has first region in which a plurality of uneven structures are disposed, and a second region spaced apart from an external region by the plurality of uneven structures. The plurality of uneven structures protrude to a predetermined height away from the semiconductor chip, the molding member, and the heat dissipation member, and may be formed as a part of the head dissipation member, or formed separately.

公开(公告)号：US20220367428A1

公开(公告)日：2022-11-17

申请号：US17713309

申请日：2022-04-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongha KIM ,  Bonggyu KANG ,  Youngsoo JANG

IPC: H01L25/10

Abstract: An electronic device includes a substrate, a first plate having a first internal surface facing a first surface of the substrate, and at least one first through-hole and at least one second through-hole, first and second semiconductor packages spaced apart from each other between the first surface and the first internal surface, a first thermal interface material layer contacting an upper surface of the first semiconductor package and the first internal surface, and filling at least a portion of the at least one first through-hole, and a second thermal interface material layer contacting an upper surface of the second semiconductor package and the first internal surface, and filling at least a portion of the at least one second through-hole. At least one of side surfaces of the first and second thermal interface material layers is exposed to an empty space between the first internal surface and the first surface.