公开(公告)号：US20200326865A1

公开(公告)日：2020-10-15

申请号：US16914724

申请日：2020-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wang-Soo KIM ,  Jung-Hwan CHOI ,  Ki-Duk PARK ,  Yoo-Chang SUNG ,  Jin-Sung YOUN ,  Chang-Kyo LEE ,  Ju-Ho JEON ,  Jin-Seok HEO

IPC: G06F3/06 ,  H04L25/03 ,  G11C29/02 ,  G11C5/04 ,  G11C29/12

Abstract: A memory module includes a plurality of semiconductor memory devices associated with a same module board. The plurality of semiconductor memory devices configured to simultaneously perform a training operation, the plurality of semiconductor memory devices including a reception interface circuit configured to perform the training operation to search for selected equalization coefficients of an equalizer based on a training pattern from a memory controller, and transmit a training information signal to the memory controller in a training mode in response to a training command from the memory controller, the training information signal including the selected equalization coefficients.