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公开(公告)号:US20210005593A1
公开(公告)日:2021-01-07
申请号:US17025300
申请日:2020-09-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Youn-Yeol LEE , Chanho KIM
IPC: H01L25/18 , H01L25/065 , H01L23/00
Abstract: A memory device includes a peripheral circuit layer, a first memory layer provided on the peripheral circuit layer, an inter-metal layer provided on the first memory layer, and a second memory layer provided on the inter-metal layer. The peripheral circuit layer includes a first substrate and a peripheral circuit provided on the first substrate. The first memory layer includes a first memory structure electrically connected to the peripheral circuit through metal bonding pads. The inter-metal layer includes intermediate pads electrically connected to the peripheral circuit through metal bonding pads. The second memory layer includes a second memory structure electrically connected with the intermediate pads and a second substrate provided on the second memory structure. The peripheral circuit, the first memory structure, and the second structure are provided between the first substrate and the second substrate.
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公开(公告)号:US20190189632A1
公开(公告)日:2019-06-20
申请号:US16030170
申请日:2018-07-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Youn-Yeol LEE , Chanho Kim
IPC: H01L27/11575 , H01L27/11573 , H01L27/1157 , H01L27/11582 , G11C16/04
Abstract: A memory device includes a substrate, a first memory structure including a plurality of first word lines stacked on the substrate in a direction perpendicular to a top surface of the substrate, an inter-metal layer on the first memory structure and including a plurality of intermediate pads connected with separate, respective first word lines of the plurality of first word lines, a second memory structure including a plurality of second word lines stacked on the inter-metal layer in the direction perpendicular to the top surface of the substrate, and an upper metal layer on the second memory structure and including a plurality of upper pads connected with separate, respective second word lines of the plurality of second word lines.
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