公开(公告)号：US20230079686A1

公开(公告)日：2023-03-16

申请号：US17717619

申请日：2022-04-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Hun CHEONG ,  Young Lyong KIM ,  Cheol Soo HAN

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56

Abstract: Provided is a semiconductor package with improved reliability. The semiconductor package includes: a plurality of connection terminals on a first surface of the semiconductor device; a protection member on the first surface of the semiconductor device and partially covers side surfaces of the plurality of connection terminals such that the protective member exposes lower surfaces of the plurality of connection terminals; and a mold member that covers a side surface of the semiconductor device and a portion of the protection member such that the mold member does not cover the lower surfaces of the plurality of connection terminals.