公开(公告)号：US20210120681A1

公开(公告)日：2021-04-22

申请号：US17069965

申请日：2020-10-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hangyu HWANG ,  Youngjong SHIN ,  Sangbeom KO ,  Sungho CHO ,  Sunyoung JI ,  Younghee CHOI ,  Changyoun HWANG

IPC: H05K5/00 ,  B29C45/37

Abstract: An electronic device and method for forming a housing of the same is disclosed. The electronic device includes: a housing including: a first plate forming a front surface of the housing, a second plate integrally forming a rear surface and side surface of the housing, wherein a space is enclosed between the front surface, side surface and rear surface, and wherein the second plate includes a first surface forming the side and rear surfaces of the housing, and a second surface disposed opposite to the first surface, and a display disposed in the space and at least partially visible through the first plate, wherein at least a portion of the second surface includes a pattern having surface roughness having a height of 0.1 μm to 1 μm.