公开(公告)号：US07969733B1

公开(公告)日：2011-06-28

申请号：US12336851

申请日：2008-12-17

申请人： Samuel Abbay ,  Jeong Hun Kim ,  Don Le

发明人： Samuel Abbay ,  Jeong Hun Kim ,  Don Le

IPC分类号： H05K7/20

CPC分类号： G06F1/20

摘要： A heat transfer system, method, and computer program product are provided for use with multiple circuit board environments. In use, a heat transfer component configured to be situated between a first circuit board and a second circuit board is provided. Such heat transfer component is in thermal communication with a first processor of the first circuit board and a second processor of the second circuit board. Furthermore, the heat transfer component is situated between the first circuit board and the second circuit board.

摘要翻译： 提供传热系统，方法和计算机程序产品，用于多个电路板环境。 在使用中，提供构造成位于第一电路板和第二电路板之间的传热部件。 这种传热部件与第一电路板的第一处理器和第二电路板的第二处理器热连通。 此外，传热部件位于第一电路板和第二电路板之间。