公开(公告)号：US10090278B2

公开(公告)日：2018-10-02

申请号：US15393754

申请日：2016-12-29

申请人： Sang-Sick Park ,  Geol Nam ,  Tae Hong Min ,  Jihwan Hwang

发明人： Sang-Sick Park ,  Geol Nam ,  Tae Hong Min ,  Jihwan Hwang

IPC分类号： H01L25/065 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/00

摘要： A semiconductor package includes a plurality of semiconductor chips on a substrate. The semiconductor chips include a first semiconductor chip, a second semiconductor chip, and a third semiconductor chip that are sequentially stacked on the substrate. The semiconductor package further includes a plurality of non-conductive layers between the substrate and the first semiconductor chip and between adjacent semiconductor chips among the semiconductor chips. The semiconductor chips include smaller widths as a distance from the substrate increases. Each of the non-conductive layers includes an extension protruding outward from a side surface of an overlying one of the semiconductor chips.