公开(公告)号：US20120320609A1

公开(公告)日：2012-12-20

申请号：US13597804

申请日：2012-08-29

申请人： Satoshi WATANABE ,  Keiichi SHIMIZU ,  Takeshi OSADA ,  Keiichi SHIMIZU ,  Toshiya TANAKA ,  Shigeru OSAWA ,  Takeshi HISAYASU ,  Hirokazu OTAKE ,  Hitoshi KAWANO ,  Makoto SAKAI

发明人： Satoshi WATANABE ,  Keiichi SHIMIZU ,  Takeshi OSADA ,  Keiichi SHIMIZU ,  Toshiya TANAKA ,  Shigeru OSAWA ,  Takeshi HISAYASU ,  Hirokazu OTAKE ,  Hitoshi KAWANO ,  Makoto SAKAI

IPC分类号： F21V29/00

CPC分类号： F21V29/004 ,  F21K9/20 ,  F21V19/001 ,  F21V19/006 ,  F21V29/67 ,  F21V29/73 ,  F21V29/74 ,  F21Y2115/10 ,  H01R33/9456 ,  Y10T29/49879

摘要： A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.

公开(公告)号：US20120313551A1

公开(公告)日：2012-12-13

申请号：US13423573

申请日：2012-03-19

申请人： Hiromichi NAKAJIMA ,  Yuichiro TAKAHARA ,  Hiroshi MATSUSHITA ,  Masahiro TODA ,  Shigeru OSAWA ,  Ryotaro MATSUDA ,  Jun SASAKI ,  Takeshi OSADA

发明人： Hiromichi NAKAJIMA ,  Yuichiro TAKAHARA ,  Hiroshi MATSUSHITA ,  Masahiro TODA ,  Shigeru OSAWA ,  Ryotaro MATSUDA ,  Jun SASAKI ,  Takeshi OSADA

IPC分类号： H05B37/02

CPC分类号： F21V23/006 ,  F21K9/20 ,  F21S8/02 ,  F21Y2115/10

摘要： According to one embodiment, a lamp device includes a housing including a cap, a light-emitting module arranged in the housing and a lighting circuit. The light-emitting module includes a module board, and a semiconductor light-emitting element mounted on the module board. The lighting circuit includes a circuit board, plural circuit components mounted on the circuit board, and a first thermosensor and a second thermosensor arranged at different positions on the circuit board where a temperature difference occurs at time of lighting. The lighting circuit controls lighting of the semiconductor light-emitting element according to the temperature difference between the first thermosensor and the second thermosensor.

摘要翻译： 根据一个实施例，灯装置包括壳体，其包括帽，布置在壳体中的发光模块和点灯电路。 发光模块包括模块板和安装在模块板上的半导体发光元件。 照明电路包括电路板，安装在电路板上的多个电路部件，以及布置在电路板上在发光时出现温差的不同位置处的第一热敏传感器和第二热敏传感器。 照明电路根据第一热敏传感器和第二热敏传感器之间的温度差来控制半导体发光元件的点亮。

公开(公告)号：US20120243237A1

公开(公告)日：2012-09-27

申请号：US13423140

申请日：2012-03-16

申请人： Masahiro TODA ,  Shigeru OSAWA ,  Yuichiro TAKAHARA ,  Hiroshi MATSUSHITA ,  Junichi KIMIYA

发明人： Masahiro TODA ,  Shigeru OSAWA ,  Yuichiro TAKAHARA ,  Hiroshi MATSUSHITA ,  Junichi KIMIYA

IPC分类号： F21V7/10 ,  F21V21/00

CPC分类号： F21V19/0035 ,  F21S8/026 ,  F21V21/041 ,  F21V23/006 ,  F21Y2115/10

摘要： According to one embodiment, a lamp device includes a light-emitting module including a semiconductor light-emitting element, a lighting circuit to light the semiconductor light-emitting element, and a housing to house the light-emitting module and the lighting circuit. The housing includes a case including a holder part to hold the light-emitting module, and a cap member fixed to the case by a fixing unit. The light-emitting module is sandwiched and fixed between the holder part and the cap member.

摘要翻译： 根据一个实施例，灯装置包括：发光模块，包括半导体发光元件;点亮电路，用于点亮半导体发光元件;以及壳体，用于容纳发光模块和照明电路。 壳体包括壳体，其包括用于保持发光模块的保持器部分，以及通过定影单元固定到壳体的盖构件。 发光模块被夹持并固定在保持器部分和盖部件之间。