公开(公告)号：US11976519B2

公开(公告)日：2024-05-07

申请号：US17905569

申请日：2021-03-01

Applicant: Schlumberger Technology Corporation

Inventor： Feng Yu ,  Cheng Peng ,  Ronald Eyre ,  Douglas Marsh

IPC: E21B10/567

CPC classification number: E21B10/5673

Abstract: A cutting element includes a substrate and an ultrahard layer on an upper surface of the substrate, a top surface of the ultrahard layer having a ridge extending along a major dimension of the top surface from an edge of the top surface, where the ridge has a peak with at least two different roof radii of curvature, and at least two sidewalls sloping in opposite directions from the peak of the ridge at a roof angle, where a first roof angle of the ridge proximate the edge is smaller than a second roof angle in a central portion of the ridge around a longitudinal axis of the cutting element.

公开(公告)号：US20230151697A1

公开(公告)日：2023-05-18

申请号：US17905569

申请日：2021-03-01

Applicant: Schlumberger Technology Corporation

Inventor： Feng Yu ,  Cheng Peng ,  Ronald Eyre ,  Douglas Marsh

IPC: E21B10/567

CPC classification number: E21B10/5673

Abstract: A cutting element includes a substrate and an ultrahard layer on an upper surface of the substrate, a top surface of the ultrahard layer having a ridge extending along a major dimension of the top surface from an edge of the top surface, where the ridge has a peak with at least two different roof radii of curvature, and at least two sidewalls sloping in opposite directions from the peak of the ridge at a roof angle, where a first roof angle of the ridge proximate the edge is smaller than a second roof angle in a central portion of the ridge around a longitudinal axis of the cutting element.

公开(公告)号：US20210372203A1

公开(公告)日：2021-12-02

申请号：US17290785

申请日：2019-11-08

Applicant: Schlumberger Technology Corporation

Inventor： Ronald K. Eyre ,  Feng Yu ,  Cheng Peng

IPC: E21B10/567 ,  E21B10/42 ,  B23B27/14

Abstract: A cutting element may include a substrate having a non-planar upper surface with a peripheral edge, and an ultrahard layer. The upper surface may include at least one depression formed at least proximate the peripheral edge; and a compressive stress hoop extending around the upper surface adjacent the peripheral edge, extending into the at least one depression, and configured to reduce tensile stress in the ultrahard layer. The ultrahard layer may be on the substrate and may have a non-planar top surface and an interface formed between the ultrahard layer and the substrate.