公开(公告)号：US20230110573A1

公开(公告)日：2023-04-13

申请号：US18065712

申请日：2022-12-14

Applicant: Schlumberger Technology Corporation

Inventor： Swapna Arun Kumar ,  Srinand Karuppoor

IPC: H05K1/16 ,  H05K1/02 ,  B22F10/00 ,  H01C1/01 ,  H01C7/00

Abstract: Aspects of the disclosure relate to apparatus and methods for producing a downhole electrical component, having steps of providing a non-conductive polymer substrate, establishing an active area on the non-conductive polymer substrate, patterning the active area on the non-conductive polymer substrate with a conductive material through an additive manufacturing process and incorporating the patterned non-conductive polymer substrate into a final arrangement.

公开(公告)号：US11533809B2

公开(公告)日：2022-12-20

申请号：US16599554

申请日：2019-10-11

Applicant: Schlumberger Technology Corporation

Inventor： Swapna Arun Kumar ,  Srinand Karuppoor

IPC: H05K1/16 ,  H05K1/02 ,  B22F10/00 ,  H01C1/01 ,  H01C7/00

Abstract: Aspects of the disclosure relate to apparatus and methods for producing a downhole electrical component, having steps of providing a non-conductive polymer substrate, establishing an active area on the non-conductive polymer substrate, patterning the active area on the non-conductive polymer substrate with a conductive material through an additive manufacturing process and incorporating the patterned non-conductive polymer substrate into a final arrangement.

公开(公告)号：US11930598B2

公开(公告)日：2024-03-12

申请号：US18065712

申请日：2022-12-14

Applicant: Schlumberger Technology Corporation

Inventor： Swapna Arun Kumar ,  Srinand Karuppoor

IPC: H05K1/16 ,  B22F10/00 ,  H01C1/01 ,  H01C7/00 ,  H05K1/02

CPC classification number: H05K1/167 ,  B22F10/00 ,  H01C1/01 ,  H01C7/006 ,  H05K1/0296

Abstract: Aspects of the disclosure relate to apparatus and methods for producing a downhole electrical component, having steps of providing a non-conductive polymer substrate, establishing an active area on the non-conductive polymer substrate, patterning the active area on the non-conductive polymer substrate with a conductive material through an additive manufacturing process and incorporating the patterned non-conductive polymer substrate into a final arrangement.

公开(公告)号：US20210112660A1

公开(公告)日：2021-04-15

申请号：US16599554

申请日：2019-10-11

Applicant: Schlumberger Technology Corporation

Inventor： Swapna Arun Kumar ,  Srinand Karuppoor

IPC: H05K1/16 ,  B22F3/105 ,  H05K1/02

Abstract: Aspects of the disclosure relate to apparatus and methods for producing a downhole electrical component, having steps of providing a non-conductive polymer substrate, establishing an active area on the non-conductive polymer substrate, patterning the active area on the non-conductive polymer substrate with a conductive material through an additive manufacturing process and incorporating the patterned non-conductive polymer substrate into a final arrangement.

公开(公告)号：US11523513B2

公开(公告)日：2022-12-06

申请号：US16599540

申请日：2019-10-11

Applicant: Schlumberger Technology Corporation

Inventor： Swapna Arun Kumar ,  Srinand Karuppoor

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K3/40 ,  H05K3/32 ,  E21B41/00 ,  H05K3/12

Abstract: An adapter board is described having a substrate having a width, a length and a depth and at least one electrical component placed one of within the substrate and on a surface of the substrate. The adapter board may also have a first pad positioned on the substrate, the first pad connected to the at least one electrical component through a first via. The adapter board may also have a second pad positioned on the substrate, the second pad connected to the at least one electrical component through a second via, wherein at least a portion of the adapter board is configured through an additive manufacturing process and wherein the substrate is configured to be installed within a downhole tool.

公开(公告)号：US20210112663A1

公开(公告)日：2021-04-15

申请号：US16599540

申请日：2019-10-11

Applicant: Schlumberger Technology Corporation

Inventor： Swapna Arun Kumar ,  Srinand Karuppoor

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K3/40 ,  H05K3/12 ,  H05K3/32 ,  E21B41/00

Abstract: An adapter board is described having a substrate having a width, a length and a depth and at least one electrical component placed one of within the substrate and on a surface of the substrate. The adapter board may also have a first pad positioned on the substrate, the first pad connected to the at least one electrical component through a first via. The adapter board may also have a second pad positioned on the substrate, the second pad connected to the at least one electrical component through a second via, wherein at least a portion of the adapter board is configured through an additive manufacturing process and wherein the substrate is configured to be installed within a downhole tool.