THERMAL TRIP COMPENSATION STRUCTURE
    1.
    发明申请

    公开(公告)号:US20170372858A1

    公开(公告)日:2017-12-28

    申请号:US15634062

    申请日:2017-06-27

    IPC分类号: H01H37/52

    摘要: The present disclosure relates to a thermal trip compensation structure including a tripping bar having an ejector pin, a bimetal strip, a compensating component, a support for the compensating component, and an adjustment component. One end of the bimetal strip is connected with the support. The support receives and supports the compensating component. The adjustment component is capable of adjusting a position of the compensating component relative to the support. The compensating component has an inclined slant surface which is set in such a way that a gap between the inclined slant surface and the ejector pin of the tripping bar when the bimetal strip is deflected after the occurrence of short circuit is less than the gap between the inclined slant surface and the ejector pin of the tripping bar when the bimetal strip is not deflected before the occurrence of the short circuit.