公开(公告)号：US20240186035A1

公开(公告)日：2024-06-06

申请号：US18436749

申请日：2024-02-08

Applicant: Schott AG

Inventor： Thomas Zetterer ,  Linda Johanna Bartelt ,  Jonas Baehr ,  Robert Hettler ,  Jochen Herzberg ,  Ricarda Krechel ,  Ina Mitra ,  Ina Filbert-Demut

IPC: H01B17/62 ,  A61N1/375 ,  C03C3/091 ,  H01B3/08 ,  H01R13/405

CPC classification number: H01B17/62 ,  C03C3/091 ,  H01B3/087 ,  H01R13/405 ,  A61N1/3754

Abstract: A feedthrough includes: a main body including at least one passage opening running through the main body, the main body including titanium or a titanium alloy; an insulation material accommodated in the at least one passage opening running through the main body, the insulation material including glass, the insulation material having a contact angle of less than 90 degrees at least in a plurality of regions of the insulation material with respect to the main body; and at least one electrical conductor extending through the insulation material accommodated in the at least one passage opening.

公开(公告)号：US20220219972A1

公开(公告)日：2022-07-14

申请号：US17705714

申请日：2022-03-28

Applicant: Schott AG

Inventor： Robert Hettler ,  Jens Ulrich Thomas ,  Antti Maattanen ,  Jochen Herzberg ,  Yutaka Onezawa ,  Thomas Zetterer

IPC: B81C1/00 ,  B81B3/00 ,  B23K26/324 ,  B23K26/20

Abstract: A hermetically sealed package for thermal encapsulation of a functional area includes: a base substrate; a cover substrate, the base substrate together with the cover substrate forming at least part of the package or forming the package, at least one of the base substrate or the cover substrate being in the form of a thermal insulator; at least one functional area hermetically sealed by the package, heat can be generated inside the at least one functional area of the package; and at least one laser bonding line hermetically joining the base substrate and the cover substrate to one another. The at least one laser bonding line has a height perpendicular to its bonding plane.