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公开(公告)号:US20100214732A1
公开(公告)日:2010-08-26
申请号:US12705008
申请日:2010-02-12
摘要: This disclosure relates to gasket materials used for attaching and sealing covers to enclosures. More particularly, this disclosure relates to form-in-place gaskets, applied to surfaces of containers for sensitive electronic components. The gaskets include a flexible polymer and a micropowder polyolefin filler.
摘要翻译: 本公开涉及用于将盖子附接和密封到外壳上的垫圈材料。 更具体地说,本公开内容涉及适用于敏感电子部件的容器表面的成形衬垫。 垫片包括柔性聚合物和微粉聚烯烃填料。