Heat sink and printed circuit board arrangements for data storage systems

    公开(公告)号:US11516941B2

    公开(公告)日:2022-11-29

    申请号:US17025968

    申请日:2020-09-18

    IPC分类号: H05K7/20 H05K1/02

    摘要: A system includes an enclosure having an air inlet end and an air outlet end, air movers positioned near the air outlet end, a first data connector positioned near the air outlet end between the air movers, a heat-generating electrical component positioned immediately between the data connector and the air inlet end, a first heat sink positioned immediately between at least one of the air movers and the air inlet end, and a first conductive pipe thermally coupled between the heat-generating electrical component and the first heat sink.

    HEAT SINK AND PRINTED CIRCUIT BOARD ARRANGEMENTS FOR DATA STORAGE SYSTEMS

    公开(公告)号:US20220095487A1

    公开(公告)日:2022-03-24

    申请号:US17025968

    申请日:2020-09-18

    IPC分类号: H05K7/20 H05K1/02

    摘要: A system includes an enclosure having an air inlet end and an air outlet end, air movers positioned near the air outlet end, a first data connector positioned near the air outlet end between the air movers, a heat-generating electrical component positioned immediately between the data connector and the air inlet end, a first heat sink positioned immediately between at least one of the air movers and the air inlet end, and a first conductive pipe thermally coupled between the heat-generating electrical component and the first heat sink.